Non-magnetic Tungsten Carbide Core Ring with Magnetic Permeability <1.002 and Residual Magnetization <0.05 mT Made from 100% Virgin Material

Non-magnetic Tungsten Carbide Core Ring with Magnetic Permeability <1.002 and Residual Magnetization <0.05 mT Made from 100% Virgin Material

جزئیات محصول:
محل منبع:	ژوژو، چین
نام تجاری:	Sanxin
شماره مدل:	SX1267
پرداخت:
مقدار حداقل تعداد سفارش:	2
زمان تحویل:	5-25 روز
شرایط پرداخت:	T/T ، Western Union ، L/C

اکنون تماس بگیرید

اطلاعات تکمیلی
توضیحات محصول

اطلاعات تکمیلی
نشان:	مقاوم در برابر	مقاومت شیمیایی:	مقاوم به اکثر اسید ها و قلیات
استفاده:	برش و حفاری	بعد:	قابل تنظیم
درمان سطحی:	ساده، خالی، متخلخل	لایف اسپا:	طولانی
ثبات شیمیایی:	عالی	ماده:	100 ٪ مواد vrigin
کشور مبداء:	چین	استاندارد:	ISO، RoHS
برجسته کردن:	Magnetic Permeability <1.002 Tungsten Carbide Core Ring,100% Virgin Material WC-Ni Core Ring,Residual magnetization <0.05 mT Non-magnetic Tungsten Carbide Core Ring , 100% Virgin Material WC-Ni Core Ring , Residual magnetization <0.05 mT Non-magnetic Tungsten Carbide Core Ring

توضیحات محصول

Special Anti-interference Material Non-magnetic Tungsten Carbide Core Ring

μ-grade non-magnetic tungsten carbide core ring with magnetic permeability of <1.002

When precision measurement encounters magnetic field interference, this non-magnetic core ring provides the ideal solution. Precision-manufactured using nickel-bonded tungsten carbide (WC-Ni) with a special demagnetization process, it eliminates magnetic interference issues associated with traditional tungsten steel parts. Ensures zero magnetic interference, high precision, and long-life stable operation in magnetic field-sensitive environments.

Non-Magnetic Principle: A Breakthrough in Materials Science

Non-Magnetic Mechanism:
- Nickel-based binder phase replaces traditional cobalt phase
- Magnetic permeability controlled to <1.002
- Residual magnetization <0.05 mT
Matrix material: 90% WC + 10% Ni, non-magnetic formula
Hardness: 92 HRA (Vickers hardness 1800 HV)
Density: 14.8-15.1 g/cm³
Resistivity: 0.8-1.2 μΩ*m

Applications

Consumer Electronics Manufacturing

Mobile phone camera module soldering
Micro connector soldering
TWS earphone component soldering

Semiconductor Packaging

BGA chip packaging soldering
CSP chip-scale packaging
Wafer-level soldering

Automotive Electronics

Automotive sensor soldering
ECU control unit soldering
In-vehicle camera modules

Medical Electronics

Medical sensor soldering
Implantable device packaging
Diagnostic device manufacturing

Product Specifications

Parameter Type	Specification Value	Accuracy Standard
Nominal Aperture	450µm	±1µm
Aperture Circularity	≤0.5µm	(inspected by industrial endoscope)
Flow Channel Roughness	Ra ≤0.1µm	(certified by white light interferometry)
Material Hardness	91.5 HRA	(Rockwell hardness tester)
Heat Deflection	≤0.001mm/100°C	(tested by thermal expansion tester)